Low temperature (normal temperature) resin glue powder for Wa Leng cardboard_Zibo Haixue Adhesive Technology Co., Ltd.

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Low temperature (normal temperature) resin glue powder for Wa Leng cardboard

Product Details

"Low temperature" and "normal temperature" adhesives, as the name suggests, are adhesives that have adhesion at both low and normal temperatures. They can be cured without heating, so it is also called "cold setting" production line glue, which can completely eliminate single-watt line boilers. .

　　Cold setting glue is a combination of polymer resin and corn starch, which realizes fast bonding at room temperature, high initial viscosity, low dosage, good effect, and is not easy to open the glue. At the same time, it also solves the bonding problem of high-size paper and high-density paper. Compared with traditional starch glue, the bonding strength is greatly improved.

　　According to the equipment situation and the different production conditions of each manufacturer, a fixed temperature can also be given, which can greatly increase the speed of bonding at room temperature and increase the output.

　　The promotion and application of low-temperature glue technology has greatly reduced the overall production costs of enterprises, reduced atmospheric CO2 emissions, and truly realized low-carbon, energy-saving, green and environmental protection, in line with the national packaging, packaging, recycling economy and sustainable development policies.

　　Normal temperature adhesive: Subvert the revolution of adhesives in the corrugated board production line, and deeply change the upgrading of the traditional corrugated board production line.